| PART |
Description |
Maker |
| 16192 16192-7 |
THERMAL INTERFACE PAD, (MICRO) 热接口垫，（微）
THERMAL INTERFACE PAD (MICRO)
|
Vicor, Corp.
VICOR[Vicor Corporation]
|
| 19458 19458-3 |
THERMAL INTERFACE PAD (VI-J00)
THERMAL INTERFACE PAD, (VI-J00)
|
VICOR[Vicor Corporation]
|
| SOT545-3 |
plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| P1BS |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| P2NR |
For suggested pad layout, see drawing: PAD-01
|
All Sensors Corporation
|
| ZTACV-MX ZTTCV-MX |
2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm
|
ILSI America LLC
|
| 12.000MQ22030-101860 12.000MQ2030-101860 MQ2 MQ203 |
7 x 5mm SMD, 4 pad or 2 pad
|
EUROQUARTZ limited
|
| NE2004VA10A A5800562 NE2004-VA10A |
Near edge thin film thermal printhead (8 dots / mm)
From old datasheet system
Near edge thin film thermal printhead (8 dot/mm)
Thermal Printheads > Fro Plastic Card > NE200*-, 300*-VA@ Series
|
Rohm CO.,LTD.
ROHM[Rohm]
|
| KF2008-GK11A |
Thick Film Thermal Printhead (8dots / mm)
Thermal Printheads > For POS, LABEL > KF200*-GK Series
|
Rohm CO.,LTD.
ROHM[Rohm]
|
| KD2006-DC72A |
Thick film thermal printhead (with thermal historical control)
|
Rohm
|
| 1LWP2300 5TH21000 5TH23000 |
THERMAL Pads For SC, SV and SO relays Low thermal resistance Easy to use
|
celduc-relais
|
